Skip to content

Schematic Capture and PCB Design

Phase 2, section 1 — turn a netlist intent into a fabricated board you can power, probe, and later program. This sits after Phase 1 (digital + HDL + architecture intuition) and before ARM MCU, FreeRTOS, and protocols, where you assume a working PCB or dev kit.


1. Tooling and libraries

  • EDA choice: KiCad (open, common in community projects), Altium/Cadence (industry), or comparable — pick one stack and learn its library, schematic, and board editors deeply.
  • Symbols and footprints: Verified footprints vs datasheet dimensions; 3D models for mechanical check; revision control for project + libraries (Git LFS for large assets if needed).
  • Design rules: Capture electrical rules (net classes, clearances) early so the layout tool enforces them consistently.

2. Schematic capture

  • Block diagram first: Power tree, processors/MCUs, sensors, comms (USB, Ethernet, CAN), regulators, clocks, reset, and test points.
  • Power integrity on paper: Decoupling strategy per rail (bulk + ceramic placement budget); sequencing if you use multiple supplies.
  • Interfaces: Level shifting, ESD where connectors leave the board, series resistors for debug/series termination where appropriate.
  • Design for test: Test pads, 0 Ω jumpers, optional unpop footprints for rework.

3. PCB layout (introductory through intermediate)

  • Stackup: Layer count, plane assignment (ground/power), controlled impedance when you run high-speed signals (USB, DDR, Ethernet PHY).
  • Placement: Short critical paths (switching regulators, crystal to MCU, high-speed differential pairs), thermal vias under hot parts.
  • Routing: Differential impedance, length matching where specs demand it, return paths and splits in ground (avoid crossing gaps).
  • DFM / DFA: Courtyard clearances, fiducials, panelization awareness, assembly-friendly footprints (hand vs reflow).

4. Outputs and handoff

  • Fab package: Gerbers/OBD++, drill files, pick-and-place if applicable, fab drawing with stackup notes.
  • BOM: Manufacturer part numbers, alternates, lifecycle awareness.
  • Bring-up plan: Power rails first (current-limited supply), then clocks/reset, then programming/debug connectors — feeds directly into firmware work in section 2.

Resources

  • Vendor app notes for your MCU/PMIC/PHY (layout examples are often the best teaching).
  • High-Speed Digital Design / Signal and Power Integrity references when you outgrow “rules of thumb.”

Next in Phase 2

Embedded Software — ARM MCU, FreeRTOS, protocols